发明名称 |
ELECTRONIC DEVICE INCLUDING A GUEST MATERIAL WITHIN A LAYER AND A PROCESS FOR FORMING THE SAME |
摘要 |
A process for forming an electronic device includes forming a first layer over a substrate and placing a first liquid composition over a first portion of the first layer. The first liquid composition includes at least a first guest material and a first liquid medium. The first liquid composition comes in contact with the first layer and a substantial amount of the first guest material intermixes with the first layer. An electronic device includes a substrate and a continuous first layer overlying the substrate. The continuous layer includes a first portion in which an electronic component lies and a second portion where no electronic component lies. The first portion is at least 30 nm thick and includes a first guest material, and the second portion is no more than 40 nm thick. |
申请公布号 |
EP1836722(A4) |
申请公布日期 |
2010.09.29 |
申请号 |
EP20050855997 |
申请日期 |
2005.12.29 |
申请人 |
E.I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
PRAKASH, SHIVA;MACPHERSON, CHARLES, DOUGLAS;SRDANOV, GORDANA;STAINER, MATTHEW;YU, GANG |
分类号 |
H01L21/00;H01L21/20;H01L31/12 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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