| 摘要 |
An intended purpose of this invention is to provide a laser processing machine which is capable of preventing a substrate from being contaminated and damaged due to roughness or burr of a table surface while efficiently collecting powdery dust produced during machining thereby suppressing scattering of the powdery dust and re-adherence of the powdery dust to a work surface of the substrate. For this purpose, a laser processing machine is provided which includes: a table 1 provided with levitating devices 2 and 3 for levitating a substrate 0 as a work; a conveyor device 4 configured to convey the substrate 0 being levitated in a predetermined direction relative to the table 1; a laser beam emitting device 5 configured to apply a laser beam to a work surface on a lower side of the substrate 0 being conveyed through a predetermined work area defined on the table 1; and a dust collection nozzle 7 disposed at the table 1 so as to open substantially immediately below a point of irradiation P with the laser beam applied to the work surface of the substrate 0. |
