CHIP ASSEMBLY, CONNECTING ASSEMBLY, LED AND METHOD FOR PRODUCING A CHIP ASSEMBLY

摘要

A chip arrangement for an optoelectronic component includes at least one semiconductor chip which emits electromagnetic radiation, and a connection arrangement which includes planes that are electrically insulated from one another, at least one plane having a cavity and at least one plane being a heat dissipating plane, wherein at least two electrically insulated conductors are arranged in at least the two planes, the semiconductor chip is arranged within the cavity and has at least two connection locations, and each of the connection locations is electrically conductively connected to a respective one of the conductors.