| 摘要 |
PURPOSE: It shorts, the semiconductor package forms the length of the signal return path of the first signal conductive pattern. The adjacent interference between the first signal conductive pattern is reduced. CONSTITUTION: An insulating substrate(100) has the front side(102) and the rear side(104) which each other faces. The circuit pattern comprises the first signal conductive pattern(116), arranged on the front side of the insulating substrate the first and the second earth conductive pattern(112A, 112B). The first insulating layer(106) exposes part of the first earth conductive pattern and part of the second earth conductive pattern. |
