SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS

摘要

PURPOSE: A semiconductor device and a method for manufacturing the same are provided to reduce a manufacturing cost by attaching pre-fabricated semiconductor wafers and reducing the thickness of the attached semiconductor wafers. CONSTITUTION: A first semiconductor wafer(31) includes a pre-fabricated pixel array. In the pre-fabricated pixel array, a photoelectric conversion unit and a wiring(40) are arranged in each pixel. A second semiconductor wafer(45) includes a pre-fabricated logic circuit. The first semiconductor wafer is attached to the second semiconductor wafer. The pixel array is electrically connected with the logic circuit. The attached semiconductor wafers are divided into micro chips.