| 摘要 |
<p>PURPOSE: An electronic element and a method of soldering the same are provided to discharge a fused soldering chip outside the electronic element by extending the size of a substrate electrode facing the soldering chip. CONSTITUTION: Soldering(56a-56c) are provided on substrate electrodes(36a-36c) of a print board(30). One side of an electronic component(10) is installed on a substrate electrode and is supported by a soldering chip. Both side of the electronic component are supported by the printed circuit board. The electronic component is loaded in the printed circuit board. The soldering and the soldering chip are heated.</p> |
