发明名称 APPARATUS AND METHOD OF WAFER ALIGNMENT
摘要 PURPOSE: A wafer alignment apparatus and a wafer alignment method are provided to correctly align the location of wafers regardless of the thermal expansion of a camera supporting part. CONSTITUTION: A work table(13) supports wafers to be inspected. A stage supports the work table and transfers the wafers to vertical and horizontal directions. The stage rotates the wafers in a theta axis direction. A main camera(24) is installed to be opposite to the work table and takes images from the wafers. An auxiliary camera(25) is installed to be opposite to the work table. A controller(26) processes information related to the images in order to control the stage.
申请公布号 KR20100105366(A) 申请公布日期 2010.09.29
申请号 KR20100012314 申请日期 2010.02.10
申请人 KABUSHIKI KAISHA NIHON MICRONICS 发明人 YASUTA KATSUO;MASUTA HIKARU;SUGA NORIHITO
分类号 G01R31/26;H01L21/66;H01L21/68 主分类号 G01R31/26
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