发明名称 |
APPARATUS AND METHOD OF WAFER ALIGNMENT |
摘要 |
PURPOSE: A wafer alignment apparatus and a wafer alignment method are provided to correctly align the location of wafers regardless of the thermal expansion of a camera supporting part. CONSTITUTION: A work table(13) supports wafers to be inspected. A stage supports the work table and transfers the wafers to vertical and horizontal directions. The stage rotates the wafers in a theta axis direction. A main camera(24) is installed to be opposite to the work table and takes images from the wafers. An auxiliary camera(25) is installed to be opposite to the work table. A controller(26) processes information related to the images in order to control the stage. |
申请公布号 |
KR20100105366(A) |
申请公布日期 |
2010.09.29 |
申请号 |
KR20100012314 |
申请日期 |
2010.02.10 |
申请人 |
KABUSHIKI KAISHA NIHON MICRONICS |
发明人 |
YASUTA KATSUO;MASUTA HIKARU;SUGA NORIHITO |
分类号 |
G01R31/26;H01L21/66;H01L21/68 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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