| 摘要 |
PURPOSE: A semiconductor device is provided to improve yield by preventing damage to a power line at a specific area of a chip. CONSTITUTION: A peripheral circuit is arranged between memory banks(BANK0,BANK1) and controls the memory banks. A plurality of power lines(M1_0 to M1_n) include wires formed on different layers. Each wire is connected through a via contact. A power voltage is supplied to the memory bank and the peripheral circuit through the power lines. The lowermost wire floated on the peripheral region of the memory bank is connected to an active region through a dummy via contact. A discharge path is formed on the active region and includes a junction region connected to the dummy via contact.
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