SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor package and a method for manufacturing the same are provided to easily form a plating layer on the upper side and the lower side of the package by separately implementing an electrolyte-lamination-plating process with respect to the upper side and the lower side of the package. CONSTITUTION: A metal supporting pattern(120) is formed on one side of the base pattern of a metal layer. A first plating layer(121) is formed on the opposite side of the supporting pattern. A second plating layer(111) is formed on the opposite side of the base pattern. A semiconductor chip(150) is mounted on a part of region which is located on the first plating layer. A molding part(170) surrounds the semiconductor chip and the exposed surface of the first plating layer.