MULTILAYER CHIP CAPACITOR AND FABRICATION METHOD OF MULTILAYER CHIP CAPACITOR ASSEMBLY

摘要

PURPOSE: In the manufacturing method of the stack chip capacitor and stack chip capacitor assembly is the stack-type capacitor installation process, the various ESR property is satisfied by variously changing the ESR property of capacitor according to the selection of the outer electrode connected to the external power circuit. CONSTITUTION: A plurality of dielectric layers is laminated in the capacitor main body. In a plurality of firsts and second inner electrodes(1010, 1040, 1050, 1060) is the inside of the capacitor main body, it is by turns arranged. The first and the second inner electrode have the different polarity. First outer portion electrodes and second outer electrodes are respectively formed in the side as if it is each other opposed among the surface of the capacitor main body.