PURPOSE: The ITCC package and manufacturing method thereof are that a plurality of grooves is formed in the LTCC(Low Temperature Co-fired Ceramic) substrate. The junction area between the thermally conductive adhesive and the LTCC substrate are multiplied and the efficiency for heat dissipation of the LTCC substrate is enhanced. CONSTITUTION: A plurality of grooves(130) is formed in the junction object plane of the LTCC substrate(120). The device(110) is mounted in the LTCC top of the substrate. Groove has the dot shape. It is spread so that the adhesive(140) be projected in groove. The heat sink(150) is attached on adhesive.
