PLASTIC MAGAZINE FOR RECEIVING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A plastic magazine for receiving and laminating a semiconductor package is provided to react to a proximity sensor by partially coating a conductive layer. CONSTITUTION: A plastic magazine includes left and right plates with slide grooves(214) for inputting the materials of PCB and components of an upper plate(30) and a lower plate(40). Each plate is made of heat resistance engineering plastic. A conductor is formed on at least one plate and is inserted with an operation shape.