发明名称 APPARATUS AND METHOD FOR CONTROLLING EDGE PERFORMANCE IN AN INDUCTIVELY COUPLED PLASMA CHAMBER
摘要 <p>The present invention generally provides methods and apparatus for controlling edge performance during process. One embodiment of the present invention provides an apparatus comprising a chamber body defining a process volume, a gas inlet configured to flow a process gas into the process volume, and a supporting pedestal disposed in the process volume. The supporting pedestal comprises a top plate having a substrate supporting surface configured to receive and support the substrate on a backside, and an edge surface configured to circumscribe the substrate along an outer edge of the substrate, and a height difference between a top surface of the substrate and the edge surface is used to control exposure of an edge region of the substrate to the process gas.</p>
申请公布号 KR20100105695(A) 申请公布日期 2010.09.29
申请号 KR20107015878 申请日期 2008.12.15
申请人 APPLIED MATERIALS, INC. 发明人 LIU WEI;SWENBERG JOHANES F.;NGUYEN HANH D.;NGUYEN SON T.;CURTIS ROGER;BOTTINI PHILIP A.;MARK MICHAEL J.
分类号 H01L21/3065;H05H1/34 主分类号 H01L21/3065
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