发明名称 POLYAMIDE RESIN COMPOSITION AND PROCESS FOR PRODUCING THE SAME
摘要 An object of the present invention is to provide a polyamide resin composition having high mechanical properties and high heat resistance while achieving a satisfactory balance between various physical properties. A molded product made of this polyamide resin exhibits a lower warpage and excellent surface appearance. A method for producing the polyamide resin composition is also provided. The present invention provides a polyamide resin composition containing a polyamide resin and swelling mica treated with a polyether compound having a bisphenol structure. The present invention also provides a method for making the polyamide resin composition including melt-mixing a polyamide resin with a polyether compound.
申请公布号 CA2491746(C) 申请公布日期 2010.09.28
申请号 CA20032491746 申请日期 2003.07.23
申请人 KANEKA CORPORATION 发明人 SUZUKI, NORIYUKI;HARA, KAZUHIRO;ONO, YOSHITAKA;MIYANO, ATSUSHI;MEKATA, TETSUO
分类号 C08L77/00;C08K3/04;C08K7/06;C08K9/04;C08K9/08;C08L23/08;C08L25/04;C08L25/06;C08L25/08;C08L77/02;C08L77/06 主分类号 C08L77/00
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