发明名称 |
POLYAMIDE RESIN COMPOSITION AND PROCESS FOR PRODUCING THE SAME |
摘要 |
An object of the present invention is to provide a polyamide resin composition having high mechanical properties and high heat resistance while achieving a satisfactory balance between various physical properties. A molded product made of this polyamide resin exhibits a lower warpage and excellent surface appearance. A method for producing the polyamide resin composition is also provided. The present invention provides a polyamide resin composition containing a polyamide resin and swelling mica treated with a polyether compound having a bisphenol structure. The present invention also provides a method for making the polyamide resin composition including melt-mixing a polyamide resin with a polyether compound.
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申请公布号 |
CA2491746(C) |
申请公布日期 |
2010.09.28 |
申请号 |
CA20032491746 |
申请日期 |
2003.07.23 |
申请人 |
KANEKA CORPORATION |
发明人 |
SUZUKI, NORIYUKI;HARA, KAZUHIRO;ONO, YOSHITAKA;MIYANO, ATSUSHI;MEKATA, TETSUO |
分类号 |
C08L77/00;C08K3/04;C08K7/06;C08K9/04;C08K9/08;C08L23/08;C08L25/04;C08L25/06;C08L25/08;C08L77/02;C08L77/06 |
主分类号 |
C08L77/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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