发明名称 |
Side view type LED package |
摘要 |
In a side view type light emitting diode (LED) package, a lead frame portion and lead frame electrical contact portions are exposed outside a package body to serve as an additional heat dissipation path. The side view type LED package includes an LED chip, a package body having a side surface with an opening for receiving the LED chip, and lead frames for applying a current to the LED chip. The lead frames include inner leads electrically connected to the LED chip within the package body; electrical contact lower legs extending from the inner leads to a lower portion of the package body and exposed outside the package body in the vicinity of a lower surface of the package body perpendicular to the side surface; and a heat dissipation means extending, separately from the electrical contact lower legs, from at least one of the inner leads outside the package body.
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申请公布号 |
US7804105(B2) |
申请公布日期 |
2010.09.28 |
申请号 |
US20070299882 |
申请日期 |
2007.06.27 |
申请人 |
SEOUL SEMICONDUCTOR CO., LTD. |
发明人 |
KIM NAM YOUNG;KIM TAE KWANG;HAN KYOUNG BO;LEE MYUNG HEE |
分类号 |
H01L33/00;H01L33/48;H01L33/60;H01L33/62 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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