发明名称 |
Method and apparatus for detecting defects in wafers including alignment of the wafer images so as to induce the same smear in all images |
摘要 |
A method for inspecting a wafer including a multiplicity of dies, the method including dividing an image of at least a portion of the wafer into a plurality of sub-images each representing a sub-portion of the wafer and selecting at least one defect candidate within each sub-image by comparing each sub-image to a corresponding sub-image of a reference including a representation, which is assumed to be faultless, of the portion of the wafer.
|
申请公布号 |
US7804993(B2) |
申请公布日期 |
2010.09.28 |
申请号 |
US20050068711 |
申请日期 |
2005.02.28 |
申请人 |
APPLIED MATERIALS SOUTH EAST ASIA PTE. LTD. |
发明人 |
DORPHAN YUVAL;ZASLAVSKY RAN;WAGNER MARK;FURMAN DOV;SILBERSTEIN SHAI |
分类号 |
G06K9/00;G06K9/40 |
主分类号 |
G06K9/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|