METAL FOIL TAPE FOR CIRCUIT SUBSTRATE

摘要

PURPOSE: A metal foil tape for a circuit substrate is provided to improve the heat emitting property of a semiconductor device by laminating a metal foil and an adhesive layer on the circuit substrate. CONSTITUTION: A metal foil tape is laminated on a circuit substrate. The metal foil tape is composed of a metal foil and an adhesive layer. The thickness of the metal foil is between 5 and 100um. The thickness of the adhesive layer is between 2 and 40um. The tensile modulus of the metal foil is between 5 and 40GPa.