| 摘要 |
<p>PURPOSE: A method for manufacturing a light emitting element package and the light emitting element package are provided to obtain a circuit pattern regardless of shapes and sizes by forming a loading part on a metal base through a half etching process. CONSTITUTION: A loading part(11) is formed by partially half-etching the upper side of a metal base(10). An insulating layer(20) is formed on the etched surface of the metal base. An electrode layer(30) is formed on the upper side of the insulating layer. The metal base, the insulating layer, and the electrode layer are heat-compressed. The electrode layer is etched into a desired electrode shape.</p> |
