| 摘要 |
PURPOSE: A metal nanoparticle composition comprising metal nanoparaticles, an adhesive enhancer compound, and a solvent is provided to obtain improved adhesive strength and to prevent the separation from a base material by containing the adhesive enhancer compound. CONSTITUTION: A metal nanoparticle composition having improved adhesive strength comprises metal nanoparticles, an adhesive enhancer compound, and a solvent. The adhesive enhancer compound is hydrolysable silane having one or more organic functional moieties. A method for forming a conductive shape on a base material comprises the following steps: providing a liquid composition containing the metal nanoparticles, the adhesive enhancer compound, and the solvent; forming a deposited shape by depositing the liquid composition on the base material; and forming the conductive shape on the base material by heating the deposited shape at 100-200°C.
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