发明名称 |
FABRICATING METHOD OF EPI-WAFER AND WAFER FABRICATED BY THE SAME, AND IMAGE SENSOR FABRICATED BY USING THE SAME |
摘要 |
<p>PURPOSE: An epitaxial wafer manufacturing method and an epi wafer thereof, and an image sensor thereof are provided to form a high concentration boron layer inside a wafer. CONSTITUTION: A wafer which includes boron is provided by cutting a single crystal silicon ingot(S110). An oxide film is grown in the front and the rear surface of the wafer(S120). The wafer is heat-treated(S130). An insulating layer which is formed in one side of the wafer is removed(S140). One side of the wafer is calender-grinded(S150). An epitaxial layer is formed in the front side of the wafer(S160).</p> |
申请公布号 |
KR20100103238(A) |
申请公布日期 |
2010.09.27 |
申请号 |
KR20090021760 |
申请日期 |
2009.03.13 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK, YOUNG SOO;KIM, GI JUNG;PARK, WON JE;BAE, JAE SIK |
分类号 |
H01L21/20;H01L27/146 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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