发明名称 FABRICATING METHOD OF EPI-WAFER AND WAFER FABRICATED BY THE SAME, AND IMAGE SENSOR FABRICATED BY USING THE SAME
摘要 <p>PURPOSE: An epitaxial wafer manufacturing method and an epi wafer thereof, and an image sensor thereof are provided to form a high concentration boron layer inside a wafer. CONSTITUTION: A wafer which includes boron is provided by cutting a single crystal silicon ingot(S110). An oxide film is grown in the front and the rear surface of the wafer(S120). The wafer is heat-treated(S130). An insulating layer which is formed in one side of the wafer is removed(S140). One side of the wafer is calender-grinded(S150). An epitaxial layer is formed in the front side of the wafer(S160).</p>
申请公布号 KR20100103238(A) 申请公布日期 2010.09.27
申请号 KR20090021760 申请日期 2009.03.13
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK, YOUNG SOO;KIM, GI JUNG;PARK, WON JE;BAE, JAE SIK
分类号 H01L21/20;H01L27/146 主分类号 H01L21/20
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