| 摘要 |
<p>PURPOSE: A molding apparatus for manufacturing a semiconductor package is provided to eliminate foreign materials from a vacuum hole by disassembling a cavity block. CONSTITUTION: A molding apparatus includes a lower die(200), an upper die(300), and a plurality of pins(400). A plurality of vacuum holes includes a cavity block which is formed by passing through the lower die, and the lower die absorbs the semi-assembled package. The upper die is located on the upper side of the lower die and a recess cavity is formed on the lower side of the upper mold. A plurality of pins is inserted into the vacuum holes.</p> |
