| 摘要 |
PURPOSE: A high pressure processing device and a high pressure sealing method thereof are provided to minimize volume and to be installed without space restriction by enabling wafers to be loaded and unloaded while being fixed without moving upward and downward. CONSTITUTION: A wafer closely adheres a door to a door cover(46) in which a loaded and unloaded space part is arranged and the leakage of pressure is prevented. Tightness is controlled by advancing and withdrawing a door before the difference of pressure is generated. The door is withdrawn in order to be separated from the door cover with a uniform interval.
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