| 摘要 |
PROBLEM TO BE SOLVED: To obtain a package for mounting an electronic component, which improves the high-frequency workability of the electronic component by reducing the reflecting loss of high-frequency signals when the high-frequency signals are input and output even if the use of the high-frequency electric signals increases. SOLUTION: In the package, to a mounting surface 4b of a metallic base body 4 having a through-hole 4c and the mounting surface 4b which is parallel with the length direction of the through-hole 4c, the other principal surface of a wiring board 1 having a signal-line conductor 1b to its one principal surface is joined. Then, a sealing agent is filled into the through-hole 4c, and a signal terminal 2 is fastened to the through-hole while passing through the sealing agent, and further, the end of the signal terminal 2 is connected by a brazing material 3 while overlapping with the signal-line conductor 1b. Moreover, a recess 10 is provided in a portion of the mounting surface on which the overlapping portion of the signal terminal 2 and the signal-line conductor 1b on the other principal surface of the wiring board 1 is projected. Thereby, the mismatch of impedance on the connecting portion is reduced, and the reflecting loss of high-frequency signals is also reduced, and further, the transmitting efficiency of the package is improved. COPYRIGHT: (C)2010,JPO&INPIT |
