| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a board module for which an anisotropic conductive film (ACF) in a complicated shape is stuck at an accurate position at low cost. <P>SOLUTION: On a region where the ACF 140a for FPC should be stuck at the overhang part 111 of a glass substrate 110 configuring a liquid crystal module 100, a spacer 180 comprising a substance whose adhesive strength with the ACF is extremely low (or coated with the substance) is mounted. Thus, even when using a conventional anisotropic conductive adhesive material 155 including a rectangular ACF, since a non-rectangular ACF 150a for a chip component not including the region where the ACF 140a for the FPC should be stuck is easily formed on the overhang part 111, the board module for which the anisotropic conductive film in a complicated shape, a non-rectangular shape for instance, is stuck at an accurate position is manufactured at low cost. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
