发明名称 |
METHOD OF MANUFACTURING HIGH-STRENGTH PARTICLE BOARD |
摘要 |
PROBLEM TO BE SOLVED: To manufacture a particle board which exhibits high bending strength and bending Young's modulus even in the particle board only composed of wooden chips. SOLUTION: The method of manufacturing the particle board 4 comprises: an impregnation process for impregnating wooden chips with an aqueous solution of resole-type phenol resin to obtain resin-impregnated chips; and a molding process of laminating mats of three layers made by combining a surface layer 1 and a back layer 2 obtained from resin-impregnated chips together with a core layer 3 to one another, heating and pressing the mats to mold the mats into a plate shape, wherein, in the impregnation process, an aqueous solution of the phenol resin having a weight-average molecular weight in the range of 300 to 700 is supplied so as to obtain the resin-impregnated chips of the surface layer 1 and the back layer 2 to provide the resin-impregnated chips containing 15 to 80 pts.mass of resin solid content per 100 pts.mass of bone-dry amount of wooden chip to manufacture the particle board. COPYRIGHT: (C)2010,JPO&INPIT
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申请公布号 |
JP2010208133(A) |
申请公布日期 |
2010.09.24 |
申请号 |
JP20090056342 |
申请日期 |
2009.03.10 |
申请人 |
DIC CORP;DIC KITANIHON POLYMER CO LTD;TAIHEI KOGYO CO LTD;HANWA KOGYO KK |
发明人 |
INOUE TADAYUKI;GENNO OSAMU;HOSHI TOKUO;AKIOKA MASATO;SUGIMOTO SHIGEKI;KIKUMIYA TOSHINOBU;FUKUMOTO TAKAO;MASAFUDA HAJIME |
分类号 |
B27N3/02;B27N3/06;B32B21/02 |
主分类号 |
B27N3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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