SOLID-STATE IMAGE ELEMENT, METHOD FOR MANUFACTURING, AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a back-emitted solid-state element that secures a sufficient area in a pixel portion and improves an yield.

SOLUTION: Along a scribe line 20 of a semiconductor base 30, a square termination detecting portion 21 is formed to extend in the direction of the thickness of the semiconductor base 30 from its one surface, and the termination detecting portion is harder than the semiconductor base 30 and has sides parallel with the scribe direction of the semiconductor base 30. A support substrate 36 is then pasted on one surface of the semiconductor base 30. The other surface of the semiconductor base 30 is subjected to chemical/mechanical polishing which is stopped in a self-adjusting manner at a position at which the bottom of the termination detecting portion 21 is exposed from the other surface of the semiconductor base 30. The semiconductor base 30 is thus processed into a thin form.

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