发明名称 POLYMERIZABLE EPOXY COMPOSITION, AND SEALING MATERIAL COMPOSITION COMPRISING THE SAME
摘要 To provide an epoxy polymerizable composition which exhibits low curing shrinkage and high workability and which gives a cured article having a high refraction index and high heat resistance. The epoxy polymerizable composition contains (A2) fluorene epoxy compound having the following general formula (1) or (2), (A3) epoxy compound having a softening point of 30°C or less, and (B1) thiol compound having two or more thiol groups in one molecule.
申请公布号 KR20100102642(A) 申请公布日期 2010.09.24
申请号 KR20107015147 申请日期 2009.01.23
申请人 MITSUI CHEMICALS, INC. 发明人 TAKAMATSU YASUSHI;YAMAMOTO YUGO;ITO YUICHI
分类号 C08G59/24;C08L63/00;C09K3/10;G02F1/1339 主分类号 C08G59/24
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