| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent and suppress deformation of a loop of a bonding wire connected to a semiconductor element caused by reverse flow (backflow) of a melted resin in the vicinity of one side of a cavity of a mold opposed to a resin injection side (provided with a resin injection gate) of the mold cavity while avoiding increase in the size of the mold when a plurality of such semiconductor elements mounted on a wiring circuit board are sealed with the melted resin. <P>SOLUTION: A method of manufacturing a semiconductor device includes steps of: locating a wiring circuit board 30 having a semiconductor element 31 provided on its one main surface within a resin sealing mold 50 having a cavity therein corresponding to one main surface of the wiring circuit board 30; and injecting sealing resin 70 into the cavity and sealing one main surface of the wiring circuit board 30 with the resin. When the sealing resin 70 is injected into the cavity, part of the sealing resin 70 is guided to the other main surface of the circuit board 30 via a through hole 41 selectively arranged in the circuit board 30. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
