发明名称 METHOD FOR GROWING SILICON SINGLE CRYSTAL AND METHOD FOR PRODUCING SILICON WAFER
摘要 PROBLEM TO BE SOLVED: To provide a method requiring no irradiation of a silicon single crystal with neutrons, relatively broadening the range of pulling speed of a single crystal and reducing fluctuation of the resistivity in a direction of the pulling axis and fluctuation of the in-plane resistivity in a radial direction of a silicon single crystal. SOLUTION: After a silicon single crystal 11 containing an n-type dopant is pulled from a quartz crucible 13, the silicon single crystal 11 having interstitial oxygen concentration of not more than 6.0×10<SP>17</SP>atoms/cm<SP>3</SP>, and not more than 5% of fluctuation of the in-plane resistivity in the radial direction, a silicon raw material 52 is supplied to the crucible 13 and melted, and a new silicon single crystal 11 is pulled from the quartz crucible 13. Thus, a plurality of silicon single crystals 11 are grown. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010208877(A) 申请公布日期 2010.09.24
申请号 JP20090055374 申请日期 2009.03.09
申请人 SUMCO CORP 发明人 MURAKAMI HIRONORI;KATO KOJI
分类号 C30B29/06;C30B15/00 主分类号 C30B29/06
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