METHOD OF RECYCLING WIRING BOARD AND SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To remove the contamination on the surface of an electrode pad easily and at low cost, in a method of recycling a wiring board and a semiconductor package. SOLUTION: A method of recycling a wiring board 1 that is electrically connected to a semiconductor package 11 via salient electrodes 4 of an LGA connector 5 includes: a step wherein light irradiates the surfaces of electrode pads 6 of the wiring board 1 against which the salient electrodes 4 are to be abutted to measure a first illuminance I1of the surfaces; a step wherein, after measuring the first illuminance I1, the surfaces of the electrode pads 6 are polished; a step wherein, after the polishing, the light irradiates the surfaces of the electrode pads 6 to measure a second illuminance I2of the surfaces; and a step wherein a rate of decline of illuminance of the surfaces of the electrode pads 6 after the polishing is calculated by using the first illuminance I1and the second illuminance I2, and when the rate of decline is a predetermined value or above, it is determined that the electrode pads 6 have been polished to such a degree that the electrode pads 6 can be recycled. COPYRIGHT: (C)2010,JPO&INPIT