| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of target formation for forming a target on a substrate with high efficiency, and for providing a finished surface of high quality with uniformized wall thickness. SOLUTION: In this method of target formation, the substrate 12 and an electrode 15 are inserted into a plating liquid 14 of a metal, having a property of being converted into a radioisotope by the irradiation of radioactive rays and a voltage is placed between the electrode 15 and the substrate 12 to form a target of the metal on the substrate 12. With the electrode 15 and the substrate 12 fixed in the plating liquid 14, a voltage is applied between the electrode 15 and the substrate 12; while a process for sucking the plating liquid 14 from the vicinity of the substrate 12 and a process for discharging the plating liquid 14 toward the substrate 12 is repeated. COPYRIGHT: (C)2010,JPO&INPIT
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