| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve both surface planarization and film thickness uniformity of an upper insulation film by uniformly planarizing the surface of the upper insulation film, which covers a structure having a level difference on a surface thereof, across the whole substrate in order to stably and reliably form a desired semiconductor element. Ž<P>SOLUTION: After appropriately forming a lower layer 2 of a multilayer wiring structure on a semiconductor substrate 1, an edge insulation film 14 is formed so as to cover a beveled portion 1a of the semiconductor substrate 1 and to have a thickness substantially equal to that of the lower layer 2, and then the surface of the upper insulation film 11a is planarized through a CMP process. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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