| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board for improving yield by preventing solder balls from adhering to a conductor portion around a via portion by blocking the solder balls at a portion where a resist and a silk printing portion are stacked when an insulating substrate is immersed into a solder bath. SOLUTION: The circuit board 1 includes: an insulating substrate 2; conductor portions 4 formed with a predetermined pattern on both surfaces of the insulating substrate 2 and conducting on both the surfaces of the insulating substrate 2 through a via portion 3 penetrating through the insulating substrate 2; a resist 5 for exposing a predetermined portion of each of the conductor portions 4 and covering the conductor portion 4; and a silk printing portion 6 for printing characters on the resist 5. In the circuit board, the resist 5 and the silk printing portion 6 are stacked to cover the conductor portion 4 around the via portion 3. The circuit board having the configuration described above provides significant effects that the yield in production of circuit boards is improved. COPYRIGHT: (C)2010,JPO&INPIT |
