发明名称 LED UNIT
摘要 <P>PROBLEM TO BE SOLVED: To provide an LED unit that efficiently dissipates heat generated by an LED chip and prevents impact, when connecting electric-wire, from being transferred to an LED mounting part. <P>SOLUTION: A cover 3 is put off from on a unit sub-assembly 2 in which each electric-wire 16 is crimped, and then, assembling is executed so as to lock the cover 3 to the unit sub-assembly 2, thereby completing an LED unit 1. The LED unit 1 has heat-dissipation spaces 26, 27. Therefore, even if an LED chip 9 generates heat, the heat is dissipated from a non-mounting face 14 of a pair of bus-bars 5, 6 to the heat-dissipation space 26, and also, the heat is dissipated from an electric-wire connecting part 11 of the pair of bus-bars 5, 6 to the heat-dissipation space 27, thus, the heat is dissipated to the outside of the unit from the heat-dissipation spaces. Consequently, the heat generated by the LED chip 9 is efficiently dissipated. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010212322(A) 申请公布日期 2010.09.24
申请号 JP20090054393 申请日期 2009.03.09
申请人 YAZAKI CORP 发明人 MOCHIZUKI SHINJI
分类号 H01L33/64 主分类号 H01L33/64
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