| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can prevent becoming a faulty device by a flow of a solder in assembling. <P>SOLUTION: Since a second principal surface of the first front end part 7a of a frame 7 is formed small so as to be installed on the inner side than the surface of an electrode part 4, when the electrode part 4 and the first front end part 7a are solder connected, by the self-alignment in which the solder locates and holds the first front end part 7a on the center of the electrode part 4 by the surface tension and the wet-rising phenomenon, and by wet-rising of the solder from the peripheral surface of the electrode part 4 located outside of the first front end part 7a to the side surface of the first front end part 7a, a solder-extension preventive means can be made, thus preventing adhesion of the solder on the front surface and the side surface of a semiconductor chip 3 by an outflow of the solder to the outside of the electrode part 4. <P>COPYRIGHT: (C)2010,JPO&INPIT |
