| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a local cooling device for suitably cooling a heating part. <P>SOLUTION: In the local cooling device which cools an electronic component 7 mounted on a substrate 6 by conducting heat generated by the electronic component 7 to a heat transport medium 3 through a heat pipe 10, a cold plate 2 where the heat transport medium 3 is circulated is arranged adjacent to a rack 1 where many slits 8 into which the substrate 6 is inserted, are formed; one end of the heat pipe 10 fitted to the substrate 6 together with the electronic component 7 extends toward the cold plate 2; and on a side surface of the cold plate 2, a plurality of thermal connector portions 11 into which the one end of the heat pipe 10 is inserted in a thermally conductive state by inserting the substrate 6 into the slit 8 are provided corresponding to the slits 8. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
