| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a simple heat sink structure that is practical to be coupled to an LED assembly. <P>SOLUTION: A heat sink 24 is formed from metal with high thermal conductivity, and has a planar front face 26 that is positioned to be in close thermal contact with a second side 16 of a circuit board 12. The backside of the heat sink 24 may be formed with one or more ribs or troughs that may couple with corresponding functional structures on the circuit board 12 thereby mutually aligning. In the preferred heat sink 24, a plurality of radiating elements 28 extend from the planar front face 26, perpendicularly away from the planar front face 26. <P>COPYRIGHT: (C)2010,JPO&INPIT |
