发明名称 SHOWER HEAD AND PLASMA PROCESSING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a shower head and a plasma processing apparatus, which can efficiently execute uniform plasma processing by preventing diffusion of the plasma, even when employing a structure which supplies a gas from the shower head and discharges it from the shower head. <P>SOLUTION: The shower head 100 is provided on a processing chamber 201 for processing a substrate in the inside so as to face a placing table 202 for placing the substrate and supply a gas like shower toward the substrate from a plurality of gas jetting holes 11 equipped on the opposite surface facing the placing table. The shower head 11 includes: a plurality of exhaust holes 13 provided to penetrate between an opposite surface and a surface reverse to the opposite surface, and discharging the gas from the opposite surface to the reverse surface; and a plurality of electrodes 16 provided on the surface reverse to the opposite surface and applied with a voltage for ion confinement. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010212424(A) 申请公布日期 2010.09.24
申请号 JP20090056522 申请日期 2009.03.10
申请人 TOKYO ELECTRON LTD 发明人 IIZUKA YASHIRO
分类号 H01L21/3065;H01L21/31;H05H1/46 主分类号 H01L21/3065
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