| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, in the conventional joining apparatus, sufficient joining has not been achieved by the oxidization of joining faces in stages on and after the flattening of an electrode and CMP (Chemical Mechanical Polishing) treatment. SOLUTION: The fabricating apparatus for fabricating a semiconductor device in which a plurality of semiconductor substrates are joined to the respective joining faces so as to be laminated, which includes: an activating apparatus in which the joining faces are activated; a joining apparatus in which the superimposed semiconductor substrates are joined at least by either pressurizing or heating; a measuring instrument in which the surface roughness of the joining faces before being joined by the joining apparatus is measured; and a control part in which control is performed to each of the activating apparatus, the joining apparatus and the measuring instrument. COPYRIGHT: (C)2010,JPO&INPIT |
