| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve a highly reliable wiring circuit which hardly causes wire breaking even if wiring is made finer and more complicated. Ž<P>SOLUTION: A wring structure 1 includes a semiconductor layer 10 arranged on a substrate 9 carrying gate electrodes 17, 17b, and 17c, a second interlayer dielectric 13 arranged above the substrate 9 carrying the gate electrodes 17, 17b, and 17c and the semiconductor layer 10, and wiring 18 arranged on the second interlayer dielectric 13. The semiconductor layer 10 and the wiring 18 are electrically connected in a contact hole 15 formed on the second interlayer dielectric 13, which is made of a photosensitive resin material. The contact hole 15 is filled with conductive fine grains 16 with which the semiconductor layer 10 is electrically connected to the wiring 18. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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