| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the generation of wiring short-circuit due to a bridge between wirings which consist of copper (Cu), even in a semiconductor circuit device in which fine wiring is made. Ž<P>SOLUTION: By defining a maximum value of a wiring width 12 provided by a smallest space width 13 between adjacent wirings, the generation of wiring short-circuit due to the bridge between wirings which consist of copper (Cu) can be prevented even in the semiconductor circuit device in which fine wiring is made. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
