| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor element module more accurately controlling an output of the semiconductor element by more quickly and accurately measuring the temperature of the semiconductor element. Ž<P>SOLUTION: A dent 3 is provided on the surface of opposite side of a semiconductor element 1 in a heat radiating fin 4, a temperature detection element 2 is arranged in the dent 3, and the temperature detection element 2 and the heat radiating fin 4 are thermally connected. Thus, the rough interspace on the contact surfaces between the heat radiating fin 4 and the temperature detection element 2 is filled with a thermally conductive grease to enlarge a mutual contacting area, so that a thermal conductivity efficiency between the heat radiating fin 4 and the temperature detection element 2 increases, and the temperature of the semiconductor element 1 is detected more accurately. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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