| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plating device in which the unevenness of plating treatment is improved by preventing the deposition of droplets of a plating solution which are produced by blowing a gas into a plating bath on a base material to be plated before charged into the plating bath, and wiring are not joined even when the distance between the adjacent wiring is equal to or below several ten μm which is high precise wiring. Ž<P>SOLUTION: The plating treatment device having plating vessel 1 for plating the long belt-like base material 4 to be plated and gas blowing means 2, 10, 11 for bubbling the plating bath 3 has: a means for preventing deposition of plating liquid droplets, composed of at least a plurality of guide rolls 6a-6d and a belt 5; and a removing means 16 for removing the plating liquid droplets 8 deposited on a belt 5. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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