发明名称 POLYIMIDE PRECURSOR SOLUTION, PREPREG AND CURED PRODUCT
摘要 <P>PROBLEM TO BE SOLVED: To provide a polyimide precursor solution capable of forming composite materials which exhibit high adhesive forces to reinforcing fibers such as carbon fibers, have high glass transition temperatures, little deteriorate strengths due to the high crosslinked structures of polyimides even in temperature regions equal to or higher than the glass transition temperatures, and enable the production of composite materials having high strengths and heat resistance, to provide a prepreg using the same, and to provide a cured product thereof. Ž<P>SOLUTION: The polyimide precursor solution is characterized by comprising an ester compound derived from at least one tetracarboxylic acid, at least one trivalent or more amine compound, and an organic solvent. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010209137(A) 申请公布日期 2010.09.24
申请号 JP20090053526 申请日期 2009.03.06
申请人 IST CORP 发明人 MORIUCHI KOJI;TAKEDA YASUAKI
分类号 C08L79/08;C08G73/10;C08J5/24 主分类号 C08L79/08
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