发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To reduce the generation of particles caused by material supply owing to insufficient vaporization of liquid material, and to prevent a drop of device working rate because of clogging by suppressing the generation of particles in a vaporizer and clogging of a nozzle. Ž<P>SOLUTION: The substrate processing apparatus includes: a processing chamber 203 for housing a substrate; a liquid material housing section 300 for housing a liquid material; a vaporizing mechanism 304 for vaporizing the liquid material; liquid material gas supply piping 250h and 250j for connecting the vaporizing mechanism to the processing chamber; a liquid material supply piping 250e, 250f and 250g for connecting the liquid material housing section to the vaporizing mechanism; and a preheating section 302 that is provided in the liquid material supply piping and heats and houses the liquid material. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010212390(A) 申请公布日期 2010.09.24
申请号 JP20090055921 申请日期 2009.03.10
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 HONDA KOICHI
分类号 H01L21/31;C23C16/448 主分类号 H01L21/31
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