| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of removing an electronic component which can remove the electronic component from a printed circuit board without using a device for acting physical external force, and to provide a method of reworking the electronic component. Ž<P>SOLUTION: In the method of removing the electronic component, the printed circuit board 10 is arranged so that a surface packaging type electronic component 20 soldered to the printed circuit board 10 directs to a gravity direction, solder is heated and melted, and the electronic component 20 is dropped from the printed circuit board 10. Thus, it is possible to remove the electronic component from the printed circuit board without using the device for acting physical external force. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
