| 摘要 |
A composition, suitable as a body solder material, comprises a mixture of monomeric styrene, a partially polymerized maleic anhydride-polyhydric alcohol resin and a mixture of flake and granular aluminium. The ratio of the weight of organic to inorganic material should be between 0.8 and 1.25. In the example, 100 parts of diethylene glycol-maleic anhydride resin, prepared from 100 parts of anhydride and 120 parts of glycol and having a acid number of about 42, are mixed with 44.5 parts of styrene, 39.8 parts of aluminium flake, 84.3 parts of granular aluminium, 0.8 parts of benzoyl peroxide and 0.8 parts of tricresyl phosphate. The paste is applied to a cleaned and roughened metal surface and cured, by heating, preferably by radiant heat, at a temperature of 180-220 DEG F. The filling may be ground or polished and painted and baked. |
