| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC loading substrate having a structure which can finely connect a bare chip of an IC to a printed wiring board. <P>SOLUTION: The IC loading substrate 1 has a structure in which the multilayer printed wiring board 2 obtained by stacking a plurality of insulating layers 20 made of insulating material (PTFE, etc.) and a plurality of wiring patterns 10 formed on the insulating layers 20 is electrically connected to a bare chip 3 of an IC. Of the wiring patterns 10, a region to which the bare chip 3 is electrically connected is formed as electrode parts 10a to 10f, and in the insulating layers 20 of the multilayer printed wiring board 2, a copper member 6 is buried in an area opposing to the electrode parts 10a to 10f of the wiring patterns 10 (an area directly thereunder). Furthermore, the area directly under the insulating layers 20 refers to a predetermined area inside the insulating layers 20 directly under the electrode parts 10a to 10f in a Z axis direction with a thickness direction of the insulating layers 20 being used as a Z axis. This leads to a structure in which of the insulating layers 20, the rigidity of the area directly thereunder is reinforced by the copper member 6. <P>COPYRIGHT: (C)2010,JPO&INPIT |
