| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polyimide polymer and/or its copolymer, and a positive photosensitive resin composition containing the same as a binder resin. <P>SOLUTION: The photosensitive resin composition containing a polyimide polymer derived from a 3,4-dicarboxy-1,2,3,4-tetrahydro-6-t-butyl-1-naphthalene succinic dianhydride has high resolution, high sensitivity, and the excellent film characteristics and mechanical properties as the characteristics required for a semiconductor buffer coating. <P>COPYRIGHT: (C)2010,JPO&INPIT |
