| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent easy occurrence of chipping on the backside of chips by thinning in conventional surface acoustic wave devices. <P>SOLUTION: A method of manufacturing surface acoustic wave devices includes: a step of forming a plurality of surface acoustic wave device patterns 12 on a first surface of a piezoelectric substrate 11; a step of condensing laser beams 18 inside the piezoelectric substrate 11 for irradiation to form a modified region 13 inside the piezoelectric substrate 11; a step of thinning the piezoelectric substrate 11 by grinding a second surface side at a side opposite to the first surface of the piezoelectric substrate 11; and a step of separating to each chip in the modified region 13. Chipping can be reduced regardless of thinning. <P>COPYRIGHT: (C)2010,JPO&INPIT |
